XRT75R03DIV-F Overview

The 128-LQFP package reduces the amount of space on a board.To pack telecommunications equipment, the way of Tray is used.The mounting type of this telecom circuit is Surface Mount.The telecom IC is composed of 3 circuits.When 3.135V~3.465V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.A temperature setting of -40°C~85°C ensures reliable performance.A 410mA-volt supply current is used to operate telecom equipment .

XRT75R03DIV-F Features

Available in the 128-LQFP package

XRT75R03DIV-F Applications

There are a lot of MaxLinear, Inc. XRT75R03DIV-F Telecom applications.

• Cross Connects
• Integrated Access Devices (IADs)
• Router
• Routers
• T1/E1/J1 add/drop multiplexers (MUX)
• E1 LAN/WAN Routers
• Cable Telephony
• E1 Network Equipment
• Multichannel DS1 Test Equipment
• T1/E1/J1 Performance Monitoring