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XRT83SL216IB-F

XRT83SL216IB-F

XRT83SL216IB-F

MaxLinear, Inc.

Telecom device16 Circuits

SOT-23

XRT83SL216IB-F Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 289-LFBGA
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 16
XRT83SL216IB-F Product Details

XRT83SL216IB-F Overview


289-LFBGA package is used to save board space.A Tray-packing method is used to pack telecommunications equipment.Telecommunications equipment is mounted with type Surface Mount.Telecommunications equipment consists of 16 circuits.3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.

XRT83SL216IB-F Features


Available in the 289-LFBGA package

XRT83SL216IB-F Applications


There are a lot of MaxLinear, Inc. XRT83SL216IB-F Telecom applications.

  • CSU/DSU Equipment
  • ATM Switches
  • T2 Rates PCM Line Interface
  • Digital Access Cross-connect System (DACs)
  • Digital Cross Connect Systems
  • T1 Digital Cross Connects (DSX-1)
  • Switching Systems
  • Integrated Multi-Service Access Platforms (IMAPs)
  • T1/E1/J1 Multiplexer and Channel Banks
  • Stations

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