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R5000F-AP

R5000F-AP

R5000F-AP

Micro Commercial Co

DIODE GEN PURP 5KV 200MA DO15

SOT-23

R5000F-AP Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Through Hole
Package / Case DO-204AC, DO-15, Axial
Surface MountNO
Diode Element Material SILICON
PackagingTape & Box (TB)
JESD-609 Code e3
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
HTS Code8541.10.00.70
Terminal FormWIRE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count2
JESD-30 Code O-PALF-W2
Qualification StatusNot Qualified
Number of Elements 1
Configuration SINGLE
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Voltage - Forward (Vf) (Max) @ If 6.5V @ 40V
Case Connection ISOLATED
Operating Temperature - Junction -65°C~150°C
Output Current-Max 0.2A
Voltage - DC Reverse (Vr) (Max) 5000V
Current - Average Rectified (Io) 200mA
Reverse Recovery Time 500ns
Rep Pk Reverse Voltage-Max 5000V
RoHS StatusRoHS Compliant
In-Stock:1682 items

About R5000F-AP

The R5000F-AP from Micro Commercial Co is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIODE GEN PURP 5KV 200MA DO15.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the R5000F-AP, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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