LE79234KVC Overview

To save board space, the 128-TQFP package is used.A Tray-packing method is used to pack telecommunications equipment.Mounting type Surface Mount is used.Telecom switching is mounted in a Surface Mount-direction.

LE79234KVC Features

Available in the 128-TQFP package

LE79234KVC Applications

There are a lot of Microchip Technology LE79234KVC Telecom applications.

• Wireless base stations
• PCM channel bank
• High-Density T1/E1/J1 interfaces for Multiplexers
• E1 Multiplexer
• ISDN Primary Rate Interfaces (PRA)
• Remote wireless modules
• Channel Banks
• E3/DS3 Access Equipment
• PDH Multiplexers
• ISDN NT1/TA