LE89900AMC Overview

The MSOP package reduces the amount of space on a board.In order to pack telecommunications equipment, Tube is used.Mounting type Surface Mount is used.There are 1 circuits in this telecom IC .Flexibility is achieved through 2 channels.

LE89900AMC Features

Available in the MSOP package

LE89900AMC Applications

There are a lot of Microchip Technology LE89900AMC Telecom applications.

• Short/Medium Loop
• PDH Multiplexers
• PCM Test Equipment
• Remote wireless modules
• Digital access cross connects
• T1/E1/J1 LAN/WAN Routers
• Wireless Local Loop
• Digital cross connects (DSX-1)
• SDH/SONET multiplexers
• Cable Modem