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MT8979AP1

MT8979AP1

MT8979AP1

Microchip Technology

44 Terminations44 Pin Telecom device1 Circuits

SOT-23

MT8979AP1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 44-LCC (J-Lead)
Number of Pins 44
Operating Temperature-40°C~85°C
PackagingTube
JESD-609 Code e3
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 44
Terminal Finish MATTE TIN
Technology CMOS
Voltage - Supply 4.5V~5.5V
Terminal Position QUAD
Terminal FormJ BEND
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
[email protected] Reflow Temperature-Max (s) 30
Function Transceiver
Interface PCM
Number of Circuits 1
Operating Supply Current 8mA
Max Supply Current 16mA
Data Rate2.048 Mbps
Telecom IC Type FRAMER
Height Seated (Max) 4.57mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:1766 items

MT8979AP1 Product Details

MT8979AP1 Overview


In order to save space on the board, the 44-LCC (J-Lead) package is used.Packing is done according to the Tube method.Mounting type Surface Mount is used.A 1 circuit is the heart of this telecom IC .A higher supply voltage for 4.5V~5.5V will improve efficiency.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.The mounting is in the way of Surface Mount.There are 44 terminations can be found in telecom switching configuration.The voltage it operates at is 5V.An interface with 44 pins is present on this telecom interface.As a telecom IC, FRAMER is used.Designers have a great deal of flexibility with this telecom circuit due to its operation with the supply current provided by 8mA.Normal operation requires that the supply current be kept at 16mA.

MT8979AP1 Features


Available in the 44-LCC (J-Lead) package
FRAMER as telecom IC type
Operating supply current of 8mA

MT8979AP1 Applications


There are a lot of Microchip Technology MT8979AP1 Telecom applications.

  • Home Side Box
  • Wireless Local Loop
  • Stations
  • Multichannel DS1 Test Equipment
  • Integrated Access Devices
  • Digital Access Cross-connect System (DACs)
  • CSU/DSU Equipment
  • E1 Multiplexer
  • High speed data transmission line cards
  • Microwave transmission systems

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