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ZL50023GAC

ZL50023GAC

ZL50023GAC

Microchip Technology

256 Terminations256 Pin ZL50023 Telecom device1 Circuits

SOT-23

ZL50023GAC Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-BGA
Number of Pins 256
Operating Temperature -40°C~85°C
Packaging Tray
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 256
Terminal Finish TIN LEAD
Subcategory Other Telecom ICs
Technology CMOS
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch 0.4mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number ZL50023
Function Switch
Qualification Status Not Qualified
Number of Circuits 1
Operating Supply Current 130mA
Number of Ports 32
RoHS Status Non-RoHS Compliant
ZL50023GAC Product Details

ZL50023GAC Overview


A 256-BGA package is used to reduce board space requirements.Telecommunications equipment is packed according to Tray's method.In this case, Surface Mount is the mounting type.There are 1 circuits in this telecom IC .1.71V~1.89V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Using -40°C~85°C as the operating temperature can result in reliable performance.The mounting is in the way of Surface Mount.In telecom switching configuration, there are 256 terminations.It operates with a voltage of 1.8V.The 256 pins on this interface are used for telecom.Telecom switching's base part number, ZL50023, can be used to find related parts.A designer can make use of this telecom circuit by operating with the 130mA supply current.Telecommunications device belongs to the subcategory of Other Telecom ICs.The telecom product has 32 ports.

ZL50023GAC Features


Available in the 256-BGA package
Operating supply current of 130mA

ZL50023GAC Applications


There are a lot of Microchip Technology ZL50023GAC Telecom applications.

  • PBX interfaces
  • Dual battery supply voltage SLICs
  • Intelligent PBX
  • Remote wireless modules
  • Cable modem
  • Private branch exchange (PBX)
  • Multiplexers
  • CSU/DSU E1 Interface
  • Digital Cross Connect Systems
  • T1/E1/J1 Multiplexer and Channel Banks

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