PowerPC Microprocessor - Series PCX755 360-BBGA Exposed Pad
SOT-23
PCX755CVZFU400LE Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
360-BBGA Exposed Pad
Mounting Type
Surface Mount
Supplier Device Package
360-PBGA (25x25)
Package
Tray
Base Product Number
PCX755
Mfr
Microchip Technology
Product Status
Obsolete
Operating Temperature
-40°C~110°C TJ
Packaging
Tray
Published
2006
Series
-
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
PCX755
Speed
400MHz
Core Processor
PowerPC
Voltage - I/O
2.5V 3.3V
Ethernet
-
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
-
USB
-
Additional Interfaces
-
Co-Processors/DSP
-
Security Features
-
Display & Interface Controllers
-
SATA
-
RoHS Status
Non-RoHS Compliant
PCX755CVZFU400LE Product Details
PCX755CVZFU400LE Overview
Due to its 360-BBGA Exposed Pad packaging, it is convenient to ship overseas. High reliability can be achieved by using the advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Obtain a basic understanding of operating temperature around 0°C. From the - series. PowerPC is the processor core of this CPU. Memory controllers for this CPU are -. Featuring - interfaces, this microprocessor can better serve you. There is 2.5V 3.3V I/O running on this CPU. PCX755 is a good way to search for variants of the microprocessor. Suppliers offer the package 360-PBGA (25x25).
PCX755CVZFU400LE Features
PowerPC Core
PCX755CVZFU400LE Applications
There are a lot of Microchip Technology PCX755CVZFU400LE Microprocessor applications.