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PM5326H-FI

PM5326H-FI

PM5326H-FI

Microchip Technology

Telecom device

SOT-23

PM5326H-FI Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 20 Weeks
Mounting Type Surface Mount
Supplier Device Package 1292-FCBGA
Packaging Tray
Published 1997
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Voltage - Supply 1.2V
Function SONET/SDH
Interface SFI-4
RoHS Status Non-RoHS Compliant
PM5326H-FI Product Details

PM5326H-FI Overview


A Tray-packing method is used to pack telecommunications equipment.The mounting type of this telecom circuit is Surface Mount.Improved efficiency can be ensured when the supply voltage of 1.2V is provided.

PM5326H-FI Features



PM5326H-FI Applications


There are a lot of Microchip Technology PM5326H-FI Telecom applications.

  • Channel Banks
  • High speed data transmission line cards
  • Digital Cross-connect Systems (DCS)
  • Voice over IP/DSL
  • DECT (Digital European Cordless Telephone) Base Stations
  • Set-Top Box
  • T1/E1/J1 Performance Monitoring
  • ISDN Primary Rate Interface
  • Frame Relay Switches and Access Devices (FRADS)
  • Integrated Access Devices

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