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PM8324-FEI

  • PM8324-FEI
  • PM8324-FEI

PM8324-FEI

PM8324-FEI

Microchip Technology

Telecom device

SOT-23

PM8324-FEI Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Packaging Tray
Published 2008
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Function Framer
Interface E1, T1
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
60 $212.33450 $12740.07
PM8324-FEI Product Details

PM8324-FEI Overview


A Tray-packing method is used to pack telecommunications equipment.

PM8324-FEI Features



PM8324-FEI Applications


There are a lot of Microchip Technology PM8324-FEI Telecom applications.

  • ATM equipment with integrated DS1 interfaces
  • PBXs channel bank
  • DECT (Digital European Cordless Telephone) Base
  • Switching Systems
  • Remote wireless modules
  • Frame Relay Switches and Access Devices (FRADS)
  • Digital Access Cross-connect System (DACs)
  • Wireless local loop (WLL)
  • Digital cross connects (DSX-1)
  • Switches

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