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TDA18264HB/C1Y

TDA18264HB/C1Y

TDA18264HB/C1Y

NXP USA Inc.

Telecom device16 Circuits

SOT-23

TDA18264HB/C1Y Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 80-TFQFN Exposed Pad
Packaging Tape & Reel (TR)
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Power (Watts) 2.55W
Function Transceiver
Number of Circuits 16
RoHS Status ROHS3 Compliant
TDA18264HB/C1Y Product Details

TDA18264HB/C1Y Overview


Space is saved on the board by using the 80-TFQFN Exposed Pad package.Packing is done according to the Tape & Reel (TR) method.Surface Mount is used as telecommunications equipment mounting type.This telecom IC is composed of 16 circuits.

TDA18264HB/C1Y Features


Available in the 80-TFQFN Exposed Pad package

TDA18264HB/C1Y Applications


There are a lot of NXP USA Inc. TDA18264HB/C1Y Telecom applications.

  • Private branch exchange (PBX)
  • Wireless base stations
  • E1 Multiplexer
  • T1 Rates PCM Line Interface
  • Voice over IP/DSL
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • Digital subscriber line access multiplexer (DSLAM)
  • Digital Cross-connect Systems (DCS)
  • PBX (Private Branch Exchange)
  • PCM Test Equipment

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