TSXPC860SRVZQU66D Overview

Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around -40°C~110°C TC. In the -- series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces I2C, PCMCIA, SCC, SMC, SPI, UART for better service. At 3.3V, the CPU runs its I/O. Search TSXPC860 for variants of the embedded microprocessor. It is offered by suppliers as a package 357-PBGA (25x25).

TSXPC860SRVZQU66D Features

PowerPC Core

TSXPC860SRVZQU66D Applications

There are a lot of Microchip Technology
TSXPC860SRVZQU66D Microprocessor applications.

• Television
• Heater/Fan
• Calculator
• Kindle
• Christmas lights
• 3D printers
• Washing machine
• Microwave ovens
• Home appliances
• Home video and audio