VSC7112XJW Overview

A 32-TFQFN Exposed Pad package saves space on a board.Telecommunications equipment is packed according to Tray's method.Surface Mount is used as telecommunications equipment mounting type.2 circuits make up this telecom IC .2.5V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.

VSC7112XJW Features

Available in the 32-TFQFN Exposed Pad package

VSC7112XJW Applications

There are a lot of Microchip Technology VSC7112XJW Telecom applications.

• E1 Network Equipment
• T1 Digital Cross Connects (DSX-1)
• T1/E1/J1 add/drop multiplexers (MUX)
• T3 channelized access concentrators
• Wireless base stations
• CSU/DSU E1 Interface
• Router
• Digital Cross-Connect Systems
• Hybrid fiber coax (HFC)
• Voice over IP/DSL