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VSC7424XJG-02

VSC7424XJG-02

VSC7424XJG-02

Microchip Technology

Telecom device1 Circuits

SOT-23

VSC7424XJG-02 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 672-BGA
Supplier Device Package 672-HSBGA (27x27)
Packaging Tray
Series SparXâ„¢-III-10
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 1V
Function Ethernet Switch
Interface Serial
Number of Circuits 1
Data Rate 1 Gbps
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $44.83000 $44.83
25 $37.34800 $933.7
100 $36.08860 $3608.86
VSC7424XJG-02 Product Details

VSC7424XJG-02 Overview


A 672-BGA package saves space on a board.For telecommunications equipment packing, the Tray method is used.In this case, Surface Mount is the mounting type.Telecommunications equipment consists of 1 circuits.Telecom circuit is possible to increase efficiency by providing 1V with a higher voltage.This part can perform many functions similar to the electronic parts under the SparX?-III-10 series.

VSC7424XJG-02 Features


Available in the 672-BGA package

VSC7424XJG-02 Applications


There are a lot of Microchip Technology VSC7424XJG-02 Telecom applications.

  • DECT (Digital European Cordless Telephone) Base
  • Multi-Line E1 Interface Cards
  • Fiber Optic Terminals
  • CSU/DSU E1 Interface
  • Central office
  • Routers
  • Wireless local loop (WLL)
  • Fiber
  • E3/DS3 Access Equipment
  • Multiplexers

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