VSC8541XMV-01 Overview

The 68-VFQFN Exposed Pad package reduces the amount of space on a board.Telecommunications equipment is packed using the Tray method.A Surface Mount mounting type is used.An 1-circuit makes up this telecom IC .Operating temperatures of -40°C~125°C can ensure reliable performance.

VSC8541XMV-01 Features

Available in the 68-VFQFN Exposed Pad package

VSC8541XMV-01 Applications

There are a lot of Microchip Technology VSC8541XMV-01 Telecom applications.

• Home Side Box
• T1/E1/J1 Performance Monitoring
• Integrated Multi-Service Access Platforms (IMAPs)
• Network Multiplexing and Terminating Equipment
• Channel Banks
• Digital Cross-Connect Systems
• SONET/SDH terminal
• E2 Rates PCM Line Interface
• E3/DS3 Access Equipment
• DECT (Digital European Cordless Telephone) Base