VSC8664XIC

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Manufacturer part number:VSC8664XIC

Manufacturer:Microchip Technology

Description:Telecom device1 Circuits

Case Package:SOT-23

Datasheet:VSC8664XIC Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	7 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type	Surface Mount
Package / Case	BGA
Supplier Device Package	256-BGA (17x17)
Packaging	Tray
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	90°C
Min Operating Temperature	0°C
Function	Ethernet
Number of Circuits	1
Data Rate	1.25 Gbps
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free

Quantity	Unit Price	Ext. Price
1	$216.812987	$216.812987
10	$204.540554	$2045.40554
100	$192.962787	$19296.2787
500	$182.040365	$91020.1825
1000	$171.736193	$171736.193

VSC8664XIC Overview

BGA package is used to save board space.A Tray-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.The telecom IC is composed of 1 circuits.Ensure normal operation by setting the temperature to 0°C minimum.The temperature is set at the maximum value of 90°C to ensure normal operation.