MT9HTF12872FY-667G1D6

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Manufacturer part number:MT9HTF12872FY-667G1D6

Manufacturer:Micron Technology

Description:MT9HTF12872FY-667G1D6 datasheet pdf and Memory Cards product details from Micron Technology stock available on our website

Case Package:SOT-23

Datasheet:MT9HTF12872FY-667G1D6 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	EAR99
HTS	8542.32.00.32
Module	DRAM Module
Module Density	1Gbyte
Number of Chip per Module	9
Chip Density (bit)	1G
Data Bus Width (bit)	72
Maximum Clock Rate (MHz)	667
Chip Configuration	128Mx8
Minimum Operating Supply Voltage (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Maximum Operating Supply Voltage (V)	1.9
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	95
Module Sides	Double
ECC Support	Yes
Number of Ranks	Single
Number of Chip Banks	8
CAS Latency	5
PC Type	PC2-5300
SPD EEPROM Support	Yes
Standard Package Name	DIM
Supplier Package	FBDIMM
Mounting	Socket
Package Height	30.5(Max)
Package Length	133.5(Max)
Package Width	5.1(Max)
PCB changed	240
Lead Shape	No Lead
Packaging	Tray
Part Status	Obsolete
Pin Count	240
Organization	128Mx72
PLL	No
Refresh Cycles	8K
Self Refresh	No
Module Type	240FBDIMM
RoHS Status	Yes with exemptions