M471B5673EH1-CH9

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Manufacturer part number:M471B5673EH1-CH9

Manufacturer:Samsung Electronics

Description:M471B5673EH1-CH9 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

Case Package:SOT-23

Datasheet:M471B5673EH1-CH9 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	4A994.a
Module	DRAM Module
Module Density	2Gbyte
Number of Chip per Module	16
Chip Density (bit)	1G
Data Bus Width (bit)	64
Max. Access Time (ns)	20
Maximum Clock Rate (MHz)	1333
Chip Configuration	128Mx8
Chip Package Type	FBGA
Minimum Operating Supply Voltage (V)	1.425
Typical Operating Supply Voltage (V)	1.5
Maximum Operating Supply Voltage (V)	1.575
Operating Current (mA)	1360
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	95
Supplier Temperature Grade	Commercial
Module Sides	Double
ECC Support	No
Number of Ranks	Dual
Number of Chip Banks	8
CAS Latency	9
SPD EEPROM Support	Yes
Standard Package Name	DIM
Supplier Package	USODIMM
Mounting	Socket
Package Height	30
Package Length	67.6
Package Width	3.8(Max)
PCB changed	204
Lead Shape	No Lead
Part Status	Obsolete
Pin Count	204
Organization	256Mx64
PLL	No
Self Refresh	Yes
Module Type	204USODIMM
RoHS Status	RoHS Compliant