W3H128M72E-667NBM

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Manufacturer part number:W3H128M72E-667NBM

Manufacturer:Microsemi

Description:W3H128M72E-667NBM datasheet pdf and Memory Cards product details from Microsemi stock available on our website

Case Package:SOT-23

Datasheet:W3H128M72E-667NBM Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Surface Mount	YES
Number of Terminals	208
ECCN (US)	4A994.a
Module	DRAM Module
Module Density	1Gbyte
Number of Chip per Module	5
Chip Density (bit)	1.8G
Data Bus Width (bit)	72
Max. Access Time (ns)	1.25
Maximum Clock Rate (MHz)	667
Chip Package Type	PBGA
Minimum Operating Supply Voltage (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Maximum Operating Supply Voltage (V)	1.9
Operating Current (mA)	1375
Minimum Operating Temperature (°C)	-55
Maximum Operating Temperature (°C)	125
Supplier Temperature Grade	Military
ECC Support	Yes
Number of Chip Banks	8
CAS Latency	6
SPD EEPROM Support	No
Supplier Package	BGA
Mounting	Surface Mount
Package Height	3.94(Max)
Package Length	22.1(Max)
Package Width	16.1(Max)
PCB changed	208
Number of Words	134217728 words
Package Shape	RECTANGULAR
Manufacturer	Microsemi Corporation
ECCN Code	EAR99
Additional Feature	AUTO/SELF REFRESH
HTS Code	8542.32.00.36
Technology	CMOS
Terminal Position	BOTTOM
Terminal Form	BALL
Number of Functions	1
Terminal Pitch	1 mm
Reach Compliance Code	compliant
Pin Count	208
JESD-30 Code	R-PBGA-B208
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.9 V
Temperature Grade	MILITARY
Supply Voltage-Min (Vsup)	1.7 V
Number of Ports	1
Operating Mode	SYNCHRONOUS
Organization	128Mx72
Memory Width	72
Memory Density	9663676416 bit
PLL	No
Memory IC Type	DDR DRAM
Access Mode	MULTI BANK PAGE BURST
Self Refresh	Yes
RoHS Status	Supplier Unconfirmed