WEDPN16M64V-133B2M

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Manufacturer part number:WEDPN16M64V-133B2M

Manufacturer:Microsemi

Description:WEDPN16M64V-133B2M datasheet pdf and Memory Cards product details from Microsemi stock available on our website

Case Package:SOT-23

Datasheet:WEDPN16M64V-133B2M Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	4A994.a
Module	DRAM Module
Module Density	1Gbit
Number of Chip per Module	4
Chip Density (bit)	256M
Data Bus Width (bit)	64
Max. Access Time (ns)	6\|5.5
Maximum Clock Rate (MHz)	133
Chip Configuration	16Mx16
Chip Package Type	PBGA
Minimum Operating Supply Voltage (V)	3
Typical Operating Supply Voltage (V)	3.3
Maximum Operating Supply Voltage (V)	3.6
Operating Current (mA)	540
Minimum Operating Temperature (°C)	-55
Maximum Operating Temperature (°C)	125
Supplier Temperature Grade	Military
Module Sides	Single
ECC Support	No
Number of Chip Banks	4
CAS Latency	3\|2
SPD EEPROM Support	No
Supplier Package	PBGA
Mounting	Surface Mount
Package Height	2.03(Max)
Package Length	21.1(Max)
Package Width	21.1(Max)
PCB changed	219
Part Status	Unconfirmed
Pin Count	219
Organization	16Mx64
PLL	No
Refresh Cycles	8K
Self Refresh	Yes
RoHS Status	Supplier Unconfirmed