1N6309US

new-10%

Manufacturer part number:1N6309US

Manufacturer:Microsemi Corporation

Description:ZENER DIODE 30Ohm ±5% 2.4V 100μA @ 1V -65°C~175°C 500mW 2 Terminations SQ-MELF, B

Case Package:SOT-23

Datasheet:1N6309US Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	7 Weeks
Contact Plating	Lead, Tin
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	SQ-MELF, B
Number of Pins	2
Diode Element Material	SILICON
Operating Temperature	-65°C~175°C
Packaging	Bulk
Published	1999
Tolerance	±5%
JESD-609 Code	e0
Pbfree Code	no
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	2
ECCN Code	EAR99
Terminal Finish	TIN LEAD
Additional Feature	METALLURGICALLY BONDED, HIGH RELIABILITY
HTS Code	8541.10.00.50
Max Power Dissipation	500mW
Terminal Position	END
Terminal Form	WRAP AROUND
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Pin Count	2
Qualification Status	Not Qualified
Number of Elements	1
Polarity	UNIDIRECTIONAL
Impedance	30Ohm
Element Configuration	Single
Diode Type	ZENER DIODE
Current - Reverse Leakage @ Vr	100μA @ 1V
Power Dissipation	500mW
Voltage - Forward (Vf) (Max) @ If	1.4V @ 1A
Case Connection	ISOLATED
Impedance-Max	30Ohm
Test Current	20mA
Reference Voltage	2.4V
Zener Voltage	2.4V
Voltage Tol-Max	5%
Voltage Tolerance	5%
RoHS Status	Non-RoHS Compliant