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A2F060M3E-TQ144I

A2F060M3E-TQ144I

A2F060M3E-TQ144I

Microsemi Corporation

-40°C~100°C TJ A2F060M3E System On Chip SmartFusion® Series MCU - 21, FPGA - 33 I/O

SOT-23

A2F060M3E-TQ144I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2015
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 80MHz
Base Part Number A2F060M3E
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 21, FPGA - 33
Speed 80MHz
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB
RoHS Status Non-RoHS Compliant
A2F060M3E-TQ144I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 144-LQFP to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 16KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion® series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has MCU - 21, FPGA - 33 I/Os.A flashing 128KB appears on it.Searching A2F060M3E will bring up system on chips with similar specs and purposes.At 80MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The SoC computing will start only if -40°C is set.This SoC system on chip is designed to operate at a temperature of 100°C.

ARM® Cortex®-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F060M3E-TQ144I System On Chip (SoC) applications.


  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances

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