This SoC is built on ARM® Cortex®-M3 core processor(s).

Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 288-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.It is important to note that this SoC security combines ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 31, FPGA - 78 I/Os are included in this SoC part.A 256KB flash can be seen on it.Search A2F200 for system on chips with similar specs and purposes.wireless SoCs operate at 100MHz.Core architecture of ARM underpins the SoC meaning.For the SoC computing to start, 0°C is sufficient.This SoC system on chip operates at a maximum design temperature of 85°C.

ARM® Cortex®-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

A2F200M3F-1CS288 System On Chip (SoC) applications.

• Body control module
• Industrial transport
• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics