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A2F200M3F-1FG484I

A2F200M3F-1FG484I

A2F200M3F-1FG484I

Microsemi Corporation

484 Terminations -40°C~100°C TJ 484 Pin A2F200 System On Chip SmartFusion® Series MCU - 41, FPGA - 94 I/O 1.5V

SOT-23

A2F200M3F-1FG484I Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Package / Case 484-BGA
Surface Mount YES
Number of Pins 484
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2009
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F200
Number of Outputs 94
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Operating Supply Current 1mA
Number of I/O MCU - 41, FPGA - 94
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 200000
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
Length 23mm
Height Seated (Max) 2.44mm
Width 23mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
60 $47.70000 $2862
A2F200M3F-1FG484I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion® is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of MCU - 41, FPGA - 94 I/Os in total.A power supply with a 1.5V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.575V.As a minimum, the power supply of the SoC system on a chip needs to be 1.425V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 484 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 94 outputs.This flash has a size of 256KB.A2F200 can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 100MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.This is the version with 484 pins.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F200M3F-1FG484I System On Chip (SoC) applications.


  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare

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