-40°C~100°C TJ 208 Pin A2F200 System On Chip SmartFusion® Series MCU - 22, FPGA - 66 I/O
SOT-23
A2F200M3F-1PQG208I Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Package / Case
208-BFQFP
Number of Pins
208
Supplier Device Package
208-PQFP (28x28)
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
SmartFusion®
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Frequency
100MHz
Base Part Number
A2F200
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O
MCU - 22, FPGA - 66
Speed
100MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Max Frequency
100MHz
Number of Logic Blocks (LABs)
8
Primary Attributes
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size
256KB
RoHS Status
RoHS Compliant
A2F200M3F-1PQG208I Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 208-BFQFP to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion® series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has MCU - 22, FPGA - 66 I/Os.A flashing 256KB appears on it.Searching A2F200 will bring up system on chips with similar specs and purposes.At 100MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 208-pin version.The SoC computing will start only if -40°C is set.This SoC system on chip is designed to operate at a temperature of 100°C.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 256KB extended flash. Core Architecture: ARM
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