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A2F500M3G-1FGG484I

A2F500M3G-1FGG484I

A2F500M3G-1FGG484I

Microsemi Corporation

484 Terminations -40°C~100°C TJ 484 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 41, FPGA - 128 I/O 1.5V Min 1.425V V Max 1.575V V

SOT-23

A2F500M3G-1FGG484I Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Package / Case 484-BGA
Number of Pins 484
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2015
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F500M3G
Number of Outputs 128
Qualification Status Not Qualified
Operating Supply Voltage 1.5V
Power Supplies 1.51.82.53.3V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 13.5kB
Operating Supply Current 16.5mA
Number of I/O MCU - 41, FPGA - 128
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 5500
Core Architecture ARM
Number of Gates 500000
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
Length 23mm
Height Seated (Max) 2.44mm
Width 23mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
60 $72.16483 $4329.8898
A2F500M3G-1FGG484I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion® is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of MCU - 41, FPGA - 128 I/Os in total.A power supply with a 1.5V voltage rating should be utilized when using this system on chip SoC.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 484 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 128 outputs.In order to use system on chip, you will need a power supply of 1.51.82.53.3V.This flash has a size of 512KB.A2F500M3G can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 100MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.This is the version with 484 pins.According to its specification, the maximum voltage SoC can handle is 1.575V.The SoC security receives at least 1.425V watts of power.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F500M3G-1FGG484I System On Chip (SoC) applications.


  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare

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