0°C~85°C TJ A2F500M3G System On Chip SmartFusion® Series MCU - 31, FPGA - 78 I/O
SOT-23
A2F500M3G-CS288 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Package / Case
288-TFBGA, CSPBGA
Supplier Device Package
288-CSP (11x11)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
SmartFusion®
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Frequency
80MHz
Base Part Number
A2F500M3G
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O
MCU - 31, FPGA - 78
Speed
80MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Primary Attributes
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size
512KB
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
176
$43.95818
$7736.63968
A2F500M3G-CS288 Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 288-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.It is important to note that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 31, FPGA - 78 I/Os are included in this SoC part.A 512KB flash can be seen on it.Search A2F500M3G for system on chips with similar specs and purposes.wireless SoCs operate at 80MHz.Core architecture of ARM underpins the SoC meaning.For the SoC computing to start, 0°C is sufficient.This SoC system on chip operates at a maximum design temperature of 85°C.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 512KB extended flash. Core Architecture: ARM
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A2F500M3G-CS288 System On Chip (SoC) applications.