-55°C~125°C TJ A2F500M3G System On Chip SmartFusion® Series MCU - 41, FPGA - 128 I/O
SOT-23
A2F500M3G-FGG484M Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Package / Case
484-BGA
Operating Temperature
-55°C~125°C TJ
Packaging
Tray
Series
SmartFusion®
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
HTS Code
8542.39.00.01
Frequency
80MHz
Base Part Number
A2F500M3G
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O
MCU - 41, FPGA - 128
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Primary Attributes
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size
512KB
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
60
$535.42400
$32125.44
A2F500M3G-FGG484M Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 484-BGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion® series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -55°C~125°C TJ.Taking note of the fact that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has MCU - 41, FPGA - 128 I/Os.A flashing 512KB appears on it.Searching A2F500M3G will bring up system on chips with similar specs and purposes.At 80MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 512KB extended flash. Core Architecture: ARM
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A2F500M3G-FGG484M System On Chip (SoC) applications.