In the package 484-BGA, this product is provided. Its 300 I/Os help it transfer data more efficiently. With a Surface Mount connector, this FPGA module can be attached to the development board. This device is powered by a 1.425V~1.575V battery. An FPGA belonging to the ProASIC3 series is referred to as an FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin -55°C~125°C TJ when the device is operating. There is an FPGA model contained in Tray in order to conserve space. Fpga electronics is worth mentioning that this device provides 147456 bfpga electronics s of RAM. You can find related parts by using the part number A3P1000, which is its base part number. During the configuration of this FPGA module, the RAM si18kBe reaches 18kB to ensure that the program runs normally. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. The maximal operating temperature of this module reaches 125°C. There should be a temperature difference between -55°C and the operating temperature. As a basic building block, fpga semiconductor consists of 1000000 gates. There is a device package provided by 484-FPBGA (23x23) as its supplier.
A3P1000-1FG484M Features
300 I/Os Up to 147456 RAM bits 125°C gates
A3P1000-1FG484M Applications
There are a lot of Microsemi Corporation A3P1000-1FG484M FPGAs applications.
Defense Applications
Data center hardware accelerators
Aerospace and Defense
Radar and Sensors
ASIC prototyping
Development Boards and Shields for Microcontrollers