A3P1000-1FGG484M Overview

There are two packages that contain fpga chips: 484-BGA package and X package. This device features 300 I/Os in order to transfer data in a more efficient manner. With a Surface Mount connector, this FPGA module can be attached to the development board. In order for it to operate, the supply voltage must be 1.425V~1.575V . The ProASIC3 Series is one of the types of FPGAs that belong to this type. Fpga chips is necessary to keep the operating temperature wFpga chipshin -55°C~125°C TJ when the device is operating. This FPGA model is contained in Tray for space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 147456 bFpga chipss. Parts related to this part can be found using its base part number A3P1000. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. There is a maximum operating temperature of 125°C for this module. The operating temperature should be higher than -55°C. Its basic building block contains 1000000 gates. As a supplier, 484-FPBGA (23x23) is responsible for the package of its devices.

A3P1000-1FGG484M Features

300 I/Os
Up to 147456 RAM bits
125°C gates

A3P1000-1FGG484M Applications

There are a lot of Microsemi Corporation A3P1000-1FGG484M FPGAs applications.

• Secure Communication
• Integrating multiple SPLDs
• Camera time adjustments
• Space Applications
• Electronic Warfare
• Cryptography
• Enterprise networking
• Consumer Electronics
• Scientific Instruments
• Military Temperature