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M1AFS600-1FGG256K

M1AFS600-1FGG256K

M1AFS600-1FGG256K

Microsemi Corporation

FPGAs Fusion? Series 256-LBGA

SOT-23

M1AFS600-1FGG256K Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature -55°C~100°C TJ
Packaging Tray
Published 2013
Series Fusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -55°C
Voltage - Supply 1.425V~1.575V
Base Part Number M1AFS600
Number of I/O 119
RAM Size 13.5kB
Total RAM Bits 110592
Number of Gates 600000
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
90 $369.68956 $33272.0604
M1AFS600-1FGG256K Product Details

M1AFS600-1FGG256K Overview


A 256-LBGA package is provided with this component. There are 119 I/Os for better data transfer. The Surface Mount-slot on the development board allows you to attach the FPGA module. In order to operate it, it requires a voltage supply of 1.425V~1.575V . As part of the Fusion? series of FPGAs, it is a type of FPGA. Operating temperatures should be maintained within the -55°C~100°C TJ range at all times when the unit is in use. It is for space saving reasons that this FPGA model is contained in Tray. This device has 110592 RAM bits, which is the number of RAM bits that this device offers. If you are looking for related parts, you can use the base part number M1AFS600 as a starting point. Fpga electronics is important that this FPGA module has a RAM si13.5kBe of 13.5kB in order to ensure that the program will run normally. This cable has 256 pins and is designed to connect to a computer. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. A maximum operating temperature of 100°C can be reached by this module. Over -55°C, the operating temperature should be higher. There are 600000 gates that make up its basic building block. The supplier of the device package is 256-FPBGA (17x17).

M1AFS600-1FGG256K Features


119 I/Os
Up to 110592 RAM bits
256 LABs/CLBs
100°C gates

M1AFS600-1FGG256K Applications


There are a lot of Microsemi Corporation M1AFS600-1FGG256K FPGAs applications.

  • Cryptography
  • Space Applications
  • Ecosystem
  • Software-defined radio
  • Camera time adjustments
  • Medical imaging
  • Image processing
  • Industrial Ethernet
  • Military Temperature
  • Medical Applications

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