There are two packages that contain fpga chips: 208-BFQFP package and X package. This device features 154 I/Os in order to transfer data in a more efficient manner. The Surface Mount-slot on the development board allows you to attach the FPGA module. The supply voltage of the device is 1.425V~1.575V , at which it runs. It is a type of FPGA that belongs to the ProASIC3 series of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. The RAM bits that this device offer is 110592. Parts related to this part can be found using its base part number A3P600. During the configuration of this FPGA module, the RAM si13.5kBe reaches 13.5kB to ensure that the program runs normally. Fpga electronics is designed wfpga electronics h 208 pins. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Its flexibility is fully utilized when operated with a supply voltage of 1.5V. When this module is operated at its maximum operating temperature, it reaches 70°C. The operating temperature should be higher than 0°C. Fpga semiconductor is made up of 600000 gates as fpga semiconductors basic building block. The registers used in the transfer of and storage of data are 13824 in number. There is a maximum supply voltage of 1.575V that is supported by this product. The device can function at a minimum voltage of 1.425V. Fpga semiconductor is possible for this FPGA to reach speeds of up to 272MHz. Device package 208-PQFP (28x28) is provided by its supplier.
A3P600-1PQG208 Features
154 I/Os Up to 110592 RAM bits 208 LABs/CLBs 70°C gates 13824 registers
A3P600-1PQG208 Applications
There are a lot of Microsemi Corporation A3P600-1PQG208 FPGAs applications.