AX500-2FGG676I Overview

Fpga chips is supplied in the 676-BGA package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. A total of 336 I/Os allow data to be transferred in a more coherent manner. In order for the device to operate, a supply voltage of 1.5V volts needs to be provided. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order to operate it, it requires a voltage supply of 1.425V~1.575V . The Axcelerator Series is one of the types of FPGAs that belong to this type. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~85°C TA when the device is operating. The device has 336 outputs that are integrated into it. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. There are a total of 676 terminations. The RAM bits that are offered by this fpga chips are 73728. Parts related to this part can be found using its base part number AX500. The RAM si9kBe of this FPGA module reaches 9kB so as to guarantee the normal operation of the program during operation. The device has 676 pins which are included in the design. An array of 8064 LABs/CLBs is built into the FPGA. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. A 1.5V-volt supply allows designers to fully utilize its flexibility. A basic building block for this type of building block consists of 500000 gates. The data is stored and transferred using 5376 registers that are used for this purpose. With a frequency of 870MHz, it delivers high efficiency.

AX500-2FGG676I Features

336 I/Os
Up to 73728 RAM bits
676 LABs/CLBs
5376 registers
Operating from a frequency of 870MHz

AX500-2FGG676I Applications

There are a lot of Microsemi Corporation AX500-2FGG676I FPGAs applications.

• Automotive driver's assistance
• Automotive Applications
• Audio
• Solar Energy
• Video & Image Processing
• Automotive
• Distributed Monetary Systems
• Wired Communications
• Secure Communication
• Industrial,Medical and Scientific Instruments