LE58083ABGCT Overview

The 121-LFBGA package reduces the amount of space on a board.To pack telecommunications equipment, the way of Tape & Reel (TR) is used.Telecommunications equipment is mounted with type Surface Mount.A 1-circuit composes this telecom IC .A higher supply voltage for 3.3V will improve efficiency.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.

LE58083ABGCT Features

Available in the 121-LFBGA package

LE58083ABGCT Applications

There are a lot of Microsemi Corporation LE58083ABGCT Telecom applications.

• T1/E1/J1 Multiplexer and Channel Banks
• E1 Multiplexer
• CSU/DSU E1 Interface
• Digital Access Cross-connect System (DACs)
• NIU
• Cable Modem
• Multichannel DS1 Test Equipment
• Cross Connects
• Hybrid fiber coax (HFC)
• Fiber to the Home (FTTH)