M1A3P400-1FG256 Overview

There is a 256-LBGA package that includes this component. Fpga chips is programmed wFpga chipsh 178 I/Os for transferring data in a more coherent manner. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.425V~1.575V-volt supply voltage required for the device to operate. This is a type of FPGA that is part of the ProASIC3 series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Having a RAM bit size of 55296 means that this device will offer you a lot of memory. For related parts, use its base part number M1A3P400. During the configuration of this FPGA module, the RAM si6.8kBe reaches 6.8kB to ensure that the program runs normally. In this case, 256 pins are used in the design. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. As a result of the design of this module, the maximum operating temperature reaches 70°C. Fpga electronics is recommended that the operating temperature be higher than 0°C. As a basic building block, fpga semiconductor consists of 400000 gates. Its supplier package is called 256-FPBGA (17x17).

M1A3P400-1FG256 Features

178 I/Os
Up to 55296 RAM bits
256 LABs/CLBs
70°C gates

M1A3P400-1FG256 Applications

There are a lot of Microsemi Corporation M1A3P400-1FG256 FPGAs applications.

• Software-defined radios
• High Performance Computing
• Wired Communications
• Defense Applications
• Consumer Electronics
• Aircraft navigation
• Space Applications
• Software-defined radio
• Server Applications
• Distributed Monetary Systems