M1A3P600-1FG256 Overview

As part of the 256-LBGA package, it is included. The I/Os are designed to facilitate a more coherent transfer of data. With a Surface Mount connector, this FPGA module can be attached to the development board. The supply voltage of the device is 1.425V~1.575V , at which it runs. An FPGA belonging to the ProASIC3 series is referred to as an FPGA. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. It is for space saving reasons that this FPGA model is contained in Tray. The RAM bits that are offered by this fpga chips are 110592. You can find related parts by using the part number M1A3P600, which is its base part number. It is crucial that the RAM si13.5kBe of this FPGA module reaches 13.5kB so that the program can run normally. The device has 256 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In the case of 1.5V supply voltage, designers can take full advantage of its flexibility. A maximum operating temperature of 70°C can be reached by this module. Over 0°C should be the operating temperature. 600000 gates make up the basic block of its construction. In order to store and transfer data, a total of 13824 registers are used. A maximum voltage of 1.575V can be supplied to it. Using a supply voltage as low as 1.425V, fpga semiconductor will work. As fast as 272MHz can be reached with this FPGA. As a supplier, 256-FPBGA (17x17) is responsible for the package of its devices.

M1A3P600-1FG256 Features

177 I/Os
Up to 110592 RAM bits
256 LABs/CLBs
70°C gates
13824 registers

M1A3P600-1FG256 Applications

There are a lot of Microsemi Corporation M1A3P600-1FG256 FPGAs applications.

• Industrial Ethernet
• Wired Communications
• Automotive Applications
• Automotive advanced driver assistance systems (ADAS)
• High Performance Computing
• Camera time adjustments
• Video & Image Processing
• Data center hardware accelerators
• Integrating multiple SPLDs
• Radar and Sensors