M1A3PE3000-FGG324 Overview

Fpga chips is supplied in the 324-BGA package. There are 221 I/Os for better data transfer. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates at a voltage of 1.425V~1.575V and uses a battery to supply power. It is a type of FPGA belonging to the ProASIC3E seies. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. There is an FPGA model contained in Tray in order to conserve space. As far as the RAM bits are concerned, this device offers you a total of 516096. You can find related parts by using the part number M1A3PE3000, which is its base part number. During the configuration of this FPGA module, the RAM si63kBe reaches 63kB to ensure that the program runs normally. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. As a result of the design of this module, the maximum operating temperature reaches 70°C. Over 0°C, the operating temperature should be higher. As a basic building block, fpga semiconductor consists of 3000000 gates. Its supplier package is called 324-FBGA (19x19).

M1A3PE3000-FGG324 Features

221 I/Os
Up to 516096 RAM bits
70°C gates

M1A3PE3000-FGG324 Applications

There are a lot of Microsemi Corporation M1A3PE3000-FGG324 FPGAs applications.

• ADAS
• Security systems
• Medical Applications
• Military Temperature
• Aerospace and Defense
• Digital signal processing
• Data center hardware accelerators
• Telecommunication
• Random logic
• Audio