M1AFS1500-FGG256K Overview

There are two packages that contain fpga chips: 256-LBGA package and X package. This device features 119 I/Os in order to transfer data in a more efficient manner. An FPGA module can be attached to a development board with a Surface Mount-pin. With a supply voltage of 1.425V~1.575V, this device operates with ease. As part of the Fusion? series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of -55°C~100°C TJ. As a space-saving measure, this FPGA model is contained within Tray. This device is equipped with 276480 RAM bits in terms of its RAM si276480e. In order to find related parts, you can use its base part number M1AFS1500. The FPGA module's RAM si33.8kBe reaches 33.8kB in order to ensure that the program operates in a normal manner. In order to make it work, 256 pins have been designed. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. During its maximal operating temperature, this module reaches 100°C. Over -55°C should be the operating temperature. As a basic building block, fpga semiconductor consists of 1500000 gates. 256-FPBGA (17x17) stands for its supplier device package.

M1AFS1500-FGG256K Features

119 I/Os
Up to 276480 RAM bits
256 LABs/CLBs
100°C gates

M1AFS1500-FGG256K Applications

There are a lot of Microsemi Corporation M1AFS1500-FGG256K FPGAs applications.

• Secure Communication
• Device controllers
• Bioinformatics
• Data Center
• Automotive driver's assistance
• Artificial intelligence (AI)
• Cryptography
• Medical imaging
• Industrial Ethernet
• Medical Applications