FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU9P-L2FSGD2104E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
0°C~110°C TJ
Packaging
Tray
Series
Virtex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.698V~0.742V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
676
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2586150
Total RAM Bits
391168000
Number of LABs/CLBs
147780
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU9P-L2FSGD2104E Product Details
XCVU9P-L2FSGD2104E Overview
In the package 2104-BBGA, FCBGA, this product is provided. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 676 I/Os for better data transfer. In order to construct a fundamental building block, 2586150 logic elements/cells are required. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Powered by a 0.698V~0.742V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~110°C TJ when operating the machine. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that this device offer is 391168000. A total of 147780 LABs/CLBs make up this FPGA array.
XCVU9P-L2FSGD2104E Features
676 I/Os Up to 391168000 RAM bits
XCVU9P-L2FSGD2104E Applications
There are a lot of Xilinx Inc. XCVU9P-L2FSGD2104E FPGAs applications.