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XCVU9P-L2FSGD2104E

XCVU9P-L2FSGD2104E

XCVU9P-L2FSGD2104E

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA

SOT-23

XCVU9P-L2FSGD2104E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Operating Temperature 0°C~110°C TJ
Packaging Tray
Series Virtex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.698V~0.742V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 676
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 2586150
Total RAM Bits 391168000
Number of LABs/CLBs 147780
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCVU9P-L2FSGD2104E Product Details

XCVU9P-L2FSGD2104E Overview


In the package 2104-BBGA, FCBGA, this product is provided. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 676 I/Os for better data transfer. In order to construct a fundamental building block, 2586150 logic elements/cells are required. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Powered by a 0.698V~0.742V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~110°C TJ when operating the machine. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that this device offer is 391168000. A total of 147780 LABs/CLBs make up this FPGA array.

XCVU9P-L2FSGD2104E Features


676 I/Os
Up to 391168000 RAM bits

XCVU9P-L2FSGD2104E Applications


There are a lot of Xilinx Inc. XCVU9P-L2FSGD2104E FPGAs applications.

  • Data center hardware accelerators
  • Automation
  • Medical imaging
  • Distributed Monetary Systems
  • Data Center
  • Secure Communication
  • Wired Communications
  • Ecosystem
  • Bioinformatics
  • Automotive driver's assistance

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