M2GL060-FGG676I

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Manufacturer part number:M2GL060-FGG676I

Manufacturer:Microsemi Corporation

Description:2.44mm mm FPGAs IGLOO2 Series 676-BGA 1mm mm 676

Case Package:SOT-23

Datasheet:M2GL060-FGG676I Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	6 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type	Surface Mount
Package / Case	676-BGA
Surface Mount	YES
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2015
Series	IGLOO2
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	676
HTS Code	8542.39.00.01
Voltage - Supply	1.14V~2.625V
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Supply Voltage	1.2V
Terminal Pitch	1mm
[email protected] Reflow Temperature-Max (s)	30
JESD-30 Code	S-PBGA-B676
Number of I/O	387
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells	56520
Total RAM Bits	1869824
Height Seated (Max)	2.44mm
Length	27mm
Width	27mm
RoHS Status	RoHS Compliant

Quantity	Unit Price	Ext. Price
1	$111.41000	$111.41
40	$99.57100	$3982.84

M2GL060-FGG676I Overview

There are two packages that contain fpga chips: 676-BGA package and X package. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. There are 387 I/Os for better data transfer. A fundamental building block consists of 56520 logic elements/cells. 1.2V volts power it. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates at a voltage of 1.14V~2.625V and uses a battery to supply power. There are many types of FPGAs in the IGLOO2 series, this is one of them. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. A model of this FPGA is contained in Tray for the purpose of saving space. The total number of terminations is 676. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1869824 bFpga chipss.