1.51mm mm FPGAs IGLOO2 Series 400-LFBGA 0.8mm mm 400
SOT-23
M2GL060TS-1VF400 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Lifecycle Status
IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type
Surface Mount
Package / Case
400-LFBGA
Surface Mount
YES
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2015
Series
IGLOO2
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
400
HTS Code
8542.39.00.01
Voltage - Supply
1.14V~2.625V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
240
Supply Voltage
1.2V
Terminal Pitch
0.8mm
[email protected] Reflow Temperature-Max (s)
20
JESD-30 Code
S-PBGA-B400
Number of I/O
207
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
56520
Total RAM Bits
1869824
Height Seated (Max)
1.51mm
Length
17mm
Width
17mm
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
90
$106.30144
$9567.1296
M2GL060TS-1VF400 Product Details
M2GL060TS-1VF400 Overview
Fpga chips is supplied in the 400-LFBGA package. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. 207 I/Os are available for transferring data more efficiently. A fundamental building block contains 56520 logic elements or cells. Power is provided by a 1.2V-volt supply. This FPGA module can be attached to the development board with a Surface Mount. With a supply voltage of 1.14V~2.625V, this device operates with ease. It is a type of FPGA that belongs to the IGLOO2 series of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. A model of this FPGA is contained in Tray for the purpose of saving space. 400 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1869824 bFpga chipss.
M2GL060TS-1VF400 Features
207 I/Os Up to 1869824 RAM bits
M2GL060TS-1VF400 Applications
There are a lot of Microsemi Corporation M2GL060TS-1VF400 FPGAs applications.
Secure Communication
Image processing
Distributed Monetary Systems
Audio
Telecommunication
Automotive advanced driver assistance systems (ADAS)