Welcome to Hotenda.com Online Store!

logo
userjoin
Home

M2S005S-VF256I

M2S005S-VF256I

M2S005S-VF256I

Microsemi Corporation

256 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 161 I/O 1.2V

SOT-23

M2S005S-VF256I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 12 Weeks
Package / Case 256-LFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
Published 2015
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 161
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 161
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 161
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 5K Logic Modules
Number of Logic Cells 6060
Flash Size 128KB
Length 14mm
Height Seated (Max) 1.56mm
Width 14mm
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
119 $20.84017 $2479.98023
M2S005S-VF256I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 256-LFBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 5K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 161 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 256 terminations.This SoC chip is capable of having 161 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 161 inputs.System on chips of logic are comprised of 6060 logic cells.This flash has a size of 128KB.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S005S-VF256I System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control

Related Part Number

Get Subscriber

Enter Your Email Address, Get the Latest News