484 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 82 I/O 0.85V
SOT-23
XCZU2EG-2SBVA484I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Surface Mount
YES
Package / Case
484-BFBGA, FCBGA
Published
2013
Series
Zynq® UltraScale+™ MPSoC EG
Packaging
Tray
Operating Temperature
-40°C~100°C TJ
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
484
HTS Code
8542.31.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.85V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B484
Supply Voltage-Max (Vsup)
0.876V
Number of I/O
82
Speed
533MHz, 600MHz, 1.3GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$414.70000
$414.7
XCZU2EG-2SBVA484I Product Details
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is used to build this SoC.Its package is 484-BFBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC EG series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 82.A 0.85V power supply should be used.There are voltages higher than 0.876V that should be avoided when using the SoCs wireless.Having 484 terminations in total makes system on a chip possible.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM. Built on MCU, FPGA. MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU2EG-2SBVA484I System On Chip (SoC) applications.