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M2S010-1VFG256

M2S010-1VFG256

M2S010-1VFG256

Microsemi Corporation

256 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 138 I/O 1.2V

SOT-23

M2S010-1VFG256 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 10 Weeks
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Length 14mm
Height Seated (Max) 1.56mm
Width 14mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
119 $33.87000 $4030.53
M2S010-1VFG256 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A ARM® Cortex®-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 256-LBGA package.With 64KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion®2 series.The average operating temps for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 10K Logic Modules.Housed in the state-of-art Tray package.138 I/Os in total are included in this SoC part.It is advised to utilize a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.There are 256 terminations in total and that really benefits system on a chip.You can have 138 user outputs for this SoC chip.System on chip requires 1.2V power supplies.138 inputs are available on the SoC chip.Logic system on chips features 12084 logic cells.It has a 256KB flash.Additionally, this SoC processor features LG-MIN, WD-MIN.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S010-1VFG256 System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors

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