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XAZU3EG-1SFVC784Q

XAZU3EG-1SFVC784Q

XAZU3EG-1SFVC784Q

Xilinx Inc.

784 Terminations -40°C~125°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 128 I/O 0.85V

SOT-23

XAZU3EG-1SFVC784Q Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 784
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B784
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.8MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Length 23mm
Height Seated (Max) 3.32mm
Width 23mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $622.70000 $622.7
XAZU3EG-1SFVC784Q Product Details

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


There are Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processors in this SoC.This system on a chip is packaged as 784-BFBGA, FCBGA by the manufacturer.As this SoC chip has 1.8MB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MPU, FPGA method.The Zynq® UltraScale+™ MPSoC EG series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~125°C TJ on average.There is one thing to note about this SoC security: it combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 128 I/Os.A power supply with a 0.85V rating is recommended.It is really beneficial to have system on a chip since there are 784 terminations in total.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XAZU3EG-1SFVC784Q System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system

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