-40°C~100°C TJ M2S010T System On Chip SmartFusion®2 Series 233 I/O
SOT-23
M2S010T-1FG484I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time
10 Weeks
Package / Case
484-BGA
Supplier Device Package
484-FPBGA (23x23)
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2009
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Frequency
166MHz
Base Part Number
M2S010T
Interface
CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O
233
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Core Architecture
ARM
Primary Attributes
FPGA - 10K Logic Modules
Flash Size
256KB
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
60
$52.68000
$3160.8
M2S010T-1FG484I Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 484-BGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion®2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 10K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 233 I/Os.The flash is set to 256KB.By searching M2S010T, you can find system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.It is just enough to start the SoC computing at -40°C.As designed, this SoC system on chip can operate at a maximum temperature of 100°C.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 256KB extended flash. Core Architecture: ARM
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M2S010T-1FG484I System On Chip (SoC) applications.