325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 180 I/O 1.2V
SOT-23
M2S090TS-FCSG325 Datasheet
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In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time
10 Weeks
Package / Case
325-TFBGA, CSPBGA
Surface Mount
YES
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2015
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
325
Terminal Finish
MATTE TIN
Additional Feature
LG-MIN, WD-MIN
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1.2V
Terminal Pitch
0.5mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B325
Number of Outputs
180
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.26V
Power Supplies
1.2V
Supply Voltage-Min (Vsup)
1.14V
Number of I/O
180
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Number of Inputs
180
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes
FPGA - 90K Logic Modules
Number of Logic Cells
86316
Flash Size
512KB
Length
13.5mm
Height Seated (Max)
1.16mm
Width
11mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
176
$131.92398
$23218.62048
M2S090TS-FCSG325 Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion®2 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 90K Logic Modules together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 180 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.In order to run it, it must be fed by at least 1.14V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 325 terminations in total.In order for this SoC chip to work properly, you can have 180 outputs.This system on chip SoC requires 1.2V power supply at all.The SoC chip is equipped with 180 inputs.In logic system on chips, there are 86316 logic cells.As for its flash size, it is 512KB.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 512KB extended flash. LG-MIN, WD-MIN
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M2S090TS-FCSG325 System On Chip (SoC) applications.