-40°C~100°C TJ System On Chip SmartFusion®2 Series 377 I/O
SOT-23
M2S050-FG896I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 2 weeks ago)
Factory Lead Time
7 Weeks
Package / Case
896-BGA
Supplier Device Package
896-FBGA (31x31)
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of I/O
377
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Primary Attributes
FPGA - 50K Logic Modules
Flash Size
256KB
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
27
$126.38037
$3412.26999
M2S050-FG896I Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 896-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 50K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.377 I/Os are included in this SoC part.A 256KB flash can be seen on it.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 256KB extended flash.