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M2S050-FG896I

M2S050-FG896I

M2S050-FG896I

Microsemi Corporation

-40°C~100°C TJ System On Chip SmartFusion®2 Series 377 I/O

SOT-23

M2S050-FG896I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Factory Lead Time 7 Weeks
Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 377
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 50K Logic Modules
Flash Size 256KB
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
27 $126.38037 $3412.26999
M2S050-FG896I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 896-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 50K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.377 I/Os are included in this SoC part.A 256KB flash can be seen on it.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.


There are a lot of Microsemi Corporation


M2S050-FG896I System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics

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