XC7Z030-L2SBG485I

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Manufacturer part number:XC7Z030-L2SBG485I

Manufacturer:Xilinx Inc.

Description:485 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V

Case Package:SOT-23

Datasheet:XC7Z030-L2SBG485I Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	10 Weeks
Contact Plating	Copper, Silver, Tin
Mount	Surface Mount
Package / Case	484-FBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	Zynq®-7000
Published	2010
JESD-609 Code	e1
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	485
ECCN Code	EAR99
Terminal Finish	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Additional Feature	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	1V
Terminal Pitch	0.8mm
Frequency	800MHz
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	S-PBGA-B485
Interface	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage	1.05V
Min Supply Voltage	950mV
Number of I/O	130
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA
Propagation Delay	100 ps
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Core Architecture	ARM
Boundary Scan	YES
RAM (words)	256000
Primary Attributes	Kintex™-7 FPGA, 125K Logic Cells
Number of Registers	157200
Bus Compatibility	CAN; ETHERNET; I2C; SPI; UART; USB
Length	19mm
Height Seated (Max)	2.44mm
Width	19mm
RoHS Status	ROHS3 Compliant