325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V
SOT-23
M2S060-1FCSG325 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 2 weeks ago)
Factory Lead Time
10 Weeks
Package / Case
325-TFBGA, CSPBGA
Surface Mount
YES
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2015
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
325
Terminal Finish
MATTE TIN
Additional Feature
LG-MIN, WD-MIN
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1.2V
Terminal Pitch
0.5mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B325
Number of Outputs
200
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.26V
Power Supplies
1.2V
Supply Voltage-Min (Vsup)
1.14V
Number of I/O
200
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Number of Inputs
200
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes
FPGA - 60K Logic Modules
Number of Logic Cells
56520
Flash Size
256KB
Length
11mm
Height Seated (Max)
1.01mm
Width
11mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
176
$81.83699
$14403.31024
M2S060-1FCSG325 Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion®2 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 60K Logic Modules together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 200 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.In order to run it, it must be fed by at least 1.14V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 325 terminations in total.In order for this SoC chip to work properly, you can have 200 outputs.This system on chip SoC requires 1.2V power supply at all.The SoC chip is equipped with 200 inputs.In logic system on chips, there are 56520 logic cells.As for its flash size, it is 256KB.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 256KB extended flash. LG-MIN, WD-MIN
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M2S060-1FCSG325 System On Chip (SoC) applications.